
Inhalt
Seite 4 Beckhoff New Automation Technology CB1052
4 BIOS-Einstellungen.......................................................................................................................47
4.1 Benutzung des Setups..........................................................................................................47
4.2 Top-Menü.............................................................................................................................47
4.3 Standard CMOS Features....................................................................................................48
4.3.1 SATA channels................................................................................................................49
4.3.2 PATA channel..................................................................................................................50
4.4 Advanced BIOS Features.....................................................................................................51
4.4.1 CPU Feature....................................................................................................................53
4.4.2 Hard Disk Boot Priority.....................................................................................................54
4.5 Advanced Chipset Features..................................................................................................55
4.5.1 PCI Express Root Port Function.......................................................................................57
4.6 Integrated Peripherals..........................................................................................................58
4.6.1 OnChip IDE Devices.........................................................................................................59
4.6.2 Onboard Devices..............................................................................................................61
4.6.3 SuperIO Devices..............................................................................................................62
4.6.4 USB Device Setting..........................................................................................................63
4.7 Power Management Setup...................................................................................................64
4.7.1 PCI Express PM Function.................................................................................................66
4.7.2 Intel DTS Feature.............................................................................................................67
4.8 PnP/PCI Configuration..........................................................................................................68
4.8.1 IRQ Resources.................................................................................................................70
4.9 PC Health Status..................................................................................................................71
4.10 Frequency/Voltage Control...................................................................................................72
4.11 Load Fail-Safe Defaults........................................................................................................73
4.12 Load Optimized Defaults.......................................................................................................73
4.13 Set Password.......................................................................................................................73
4.14 Save & Exit Setup.................................................................................................................73
4.15 Exit Without Saving..............................................................................................................73
5 BIOS-Update................................................................................................................................74
6 Mechanische Zeichnung...............................................................................................................75
6.1 Leiterplatte: Bohrungen........................................................................................................75
6.2 Leiterplatte: Pin-1-Abstände..................................................................................................76
6.3 Leiterplatte: Die Center.........................................................................................................77
7 Technische Daten.........................................................................................................................78
7.1 Elektrische Daten.................................................................................................................78
7.2 Umgebungsbedingungen......................................................................................................78
7.3 Thermische Spezifikationen..................................................................................................79
8 Support und Service.....................................................................................................................80
8.1 Beckhoff-Support..................................................................................................................80
8.2 Beckhoff-Service..................................................................................................................80
8.3 Beckhoff-Firmenzentrale.......................................................................................................80
I Anhang: Post-Codes.....................................................................................................................81
II Anhang: Ressourcen....................................................................................................................84
A IO-Bereich................................................................................................................................84
B Memory-Bereich.......................................................................................................................84
C Interrupt....................................................................................................................................84
D PCI-Devices.............................................................................................................................85
E Ressourcen: SMB-Devices.......................................................................................................85
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