Beckhoff CB3052 Bedienungsanleitung PDF herunterladen (Seite 4)

Inhalt

Seite 4 Beckhoff New Automation Technology CB3052

4.4.1 CPU Feature ....................................................................................................................... 48

4.4.2 Hard Disk Boot Priority ........................................................................................................ 49

4.5 Advanced Chipset Features ........................................................................................................ 50

4.5.1 PCI Express Root Port Function ......................................................................................... 51

4.6 Integrated Peripherals ................................................................................................................. 52

4.6.1 OnChip IDE Devices ........................................................................................................... 53

4.6.2 Onboard Devices ................................................................................................................ 55

4.6.3 SuperIO Devices ................................................................................................................. 56

4.6.4 USB Device Setting ............................................................................................................. 57

4.7 Power Management Setup ......................................................................................................... 58

4.7.1 PCI Express PM Function ................................................................................................... 60

4.7.2 Intel DTS Feature ................................................................................................................ 61

4.8 PnP/PCI Configuration ................................................................................................................ 62

4.8.1 IRQ Resources .................................................................................................................... 64

4.9 PC Health Status ......................................................................................................................... 65

4.10 Frequency/Voltage Control ......................................................................................................... 66

4.11 Load Fail-Safe Defaults............................................................................................................... 67

4.12 Load Optimized Defaults ............................................................................................................. 67

4.13 Set Password .............................................................................................................................. 67

4.14 Save & Exit Setup ....................................................................................................................... 67

4.15 Exit Without Saving ..................................................................................................................... 67

5 BIOS-Update ...................................................................................................................................... 68

6 Mechanische Zeichnung .................................................................................................................... 69

6.1 Leiterplatte: Bohrungen ............................................................................................................... 69

6.2 Leiterplatte: Pin-1-Abstände ....................................................................................................... 70

6.3 Leiterplatte: Heat Sink ................................................................................................................. 71

7 Technische Daten .............................................................................................................................. 72

7.1 Elektrische Daten ........................................................................................................................ 72

7.2 Umgebungsbedingungen ............................................................................................................ 72

7.3 Thermische Spezifikationen ........................................................................................................ 73

8 Support und Service ........................................................................................................................... 74

8.1 Beckhoff-Support ........................................................................................................................ 74

8.2 Beckhoff-Service ......................................................................................................................... 74

8.3 Beckhoff-Firmenzentrale ............................................................................................................. 74

I Anhang: Post-Codes .......................................................................................................................... 75

II Anhang: Ressourcen .......................................................................................................................... 78

A IO-Bereich ....................................................................................................................................... 78

B Memory-Bereich .............................................................................................................................. 78

C Interrupt ........................................................................................................................................... 78

D PCI-Devices .................................................................................................................................... 79

E Ressourcen: SMB-Devices ............................................................................................................. 80

1 2 3 4 5 6 7 8 9 ... 79 80

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