
Chapter: Overview Specifications and Documents
page 12 Beckhoff New Automation Technology CB4053
2.2 Specifications and Documents
In making this manual and for further reading of technical documentation, the following documents,
specifications and web-pages were used and are recommended.
§ ISA Specification
IEEE996P
www.ieee.org
§ PC/104™ Specification
Version 2.5
www.pc104.org
§ PC/104-Plus™ Specification
Version 2.0
www.pc104.org
§ PCI Specification
Version 2.3 and 3.0
www.pcisig.com
§ ACPI Specification
Version 3.0
www.acpi.info
§ ATA/ATAPI Specification
Version 7 Rev. 1
www.t13.org
§ USB Specifications
www.usb.org
§ SM-Bus Specification
Version 2.0
www.smbus.org
§ Intel® Chipset Description
SCH Datasheet
www.intel.com
§ Intel® Chip Description
Atom® Datasheet
www.intel.com
§ Winbond® Chip Description
W83627HF
www.winbond-usa.com or www.winbond.com.tw
§ Fintek® Chip Description
F85226F Datasheet
www.fintek.com.tw
§ Intel® Chip Description
82574L Datasheet
www.intel.com
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