
Chapter: Mechanical Drawings PCB: Heat Sink/Die Center
page 106 Beckhoff New Automation Technology CB4060
6.4 PCB: Heat Sink/Die Center
NOTE
All dimensions are in mil (1 mil = 0,0254 mm)
Mounting Hole
Chip-DIE cooling
Electrical isolated cooling required
Center Point Cooling Area
Dotted Line = Chip outline
Solid Line = Cooling Area
2029 480
1549
1130
Mounting Hole dimension H1-H6: inner diameter 71; outer diameter 118
1630
H1
3066
968
252
H3
H2
H4
1450
H6
H5
2021
1209 1640
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