Beckhoff CB3056 Bedienungsanleitung PDF herunterladen (Seite 4)

Inhalt

Seite 4 Beckhoff New Automation Technology CB3056

4.3.8 H/W Monitor ........................................................................................................................ 52

4.3.9 Serial Port Console Redirection .......................................................................................... 54

4.3.10 CPU PPM Configuration ..................................................................................................... 56

4.4 Chipset ........................................................................................................................................ 57

4.4.1 PCH-IO Configuration ......................................................................................................... 58

4.4.2 System Agent (SA) Configuration ....................................................................................... 65

4.5 Boot ............................................................................................................................................. 69

4.5.1 CSM Parameters ................................................................................................................. 71

4.6 Security ....................................................................................................................................... 72

4.6.1 Secure Boot Policy .............................................................................................................. 73

4.6.2 Key Management ................................................................................................................ 74

4.7 Save & Exit .................................................................................................................................. 76

4.8 BIOS-Update ............................................................................................................................... 77

5 Mechanische Zeichnung .................................................................................................................... 78

5.1 Leiterplatte: Bohrungen ............................................................................................................... 78

5.2 Leiterplatte: Pin-1-Abstände ....................................................................................................... 79

5.3 Leiterplatte: Heat Sink ................................................................................................................. 80

6 Technische Daten .............................................................................................................................. 81

6.1 Elektrische Daten ........................................................................................................................ 81

6.2 Umgebungsbedingungen ............................................................................................................ 81

6.3 Thermische Spezifikationen ........................................................................................................ 82

7 Support und Service ........................................................................................................................... 83

7.1 Beckhoff-Support ........................................................................................................................ 83

7.2 Beckhoff-Service ......................................................................................................................... 83

7.3 Beckhoff-Firmenzentrale ............................................................................................................. 83

I Anhang: Post-Codes .......................................................................................................................... 84

II Anhang: Ressourcen .......................................................................................................................... 85

IO-Bereich ............................................................................................................................................... 85

Memory-Bereich ..................................................................................................................................... 85

Interrupt................................................................................................................................................... 85

PCI-Devices ............................................................................................................................................ 86

Ressourcen: SMB-Devices ..................................................................................................................... 86

1 2 3 4 5 6 7 8 9 ... 85 86

Kommentare zu diesen Handbüchern

Keine Kommentare

Beckhoff CB3056 Bedienungsanleitung Seite 4

Kommentare zu diesen Handbüchern

Verwandte Produkte und Handbücher für Hardware Beckhoff CB3056